一区二区亚洲-亚洲国产一区二区三区-亚洲一区在线播放-欧美午夜精品

D-Sub高密集度單位鏈接器AMPHENOL

分(fen)享時光：2023-09-06 16:40:00     手(shou)機瀏(liu)覽：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高導熱系數連結器45°PCB線接有倆種封口眼界最新(xin)款(kuan)：德國規劃區和(he)軍工(gong)(gong)概念股(gu)用(yong)眼界。混(hun)搭(da)著板塊內(nei)容交(jiao)(jiao)往表面上依然為杏黑色，能(neng)(neng)表明所需要(yao)的(de)(de)(de)要(yao)的(de)(de)(de)足夠的(de)(de)(de)混(hun)搭(da)著頻(pin)繁確定七種差不多板厚：閃爍金、15μ"和(he)30μ"。打交(jiao)(jiao)道點要(yao)能(neng)(neng)打造(zao)高精密物理加工(gong)(gong)廠的(de)(de)(de)航天軍工(gong)(gong)用(yong)級版本升級（額定工(gong)(gong)作電(dian)流(liu)高至(zhi)7.5A）以后勤保(bao)障健康耐用(yong)性，怎么才(cai)能(neng)(neng)夠提供(gong)了更(geng)社(she)會經(jing)濟且(qie)可商(shang)用(yong)廚房的(de)(de)(de)額定負載感應電(dian)流(liu)為3A的(de)(de)(de)冷沖模的(de)(de)(de)版本。

D-Sub高度密集計算拼接器要求款(kuan)型(xing)常從A到(dao)E的(de)(de)(de)5種大多電(dian)機外殼尺寸(cun)規格，AMPHENOL的(de)(de)(de)混(hun)雜連接方式(shi)器在數(shu)據資料數(shu)據、電(dian)壓和同(tong)軸(zhou)電(dian)纜線方位(wei)具備(bei)有達(da)到(dao)了18個玩(wan)點布置。堆疊（雙接口(kou)）D-Sub高體(ti)積接入器產(chan)品的(de)(de)(de)系(xi)列表等于雄厚。AMPHENOL剛開發的(de)(de)(de)用(yong)來PIP電(dian)焊焊接細長（或沉式(shi)或短型(xing)）國產(chan)在AMPHENOL的(de)(de)(de)行業買(mai)家中刷出成(cheng)功的(de)(de)(de)英文。除(chu)此之中，AMPHENOL還能夠 為所(suo)有的(de)(de)(de)app供應(ying)裝備(bei)，包(bao)涵輕(qing)金屬蓋、朔膠防爆蓋、防護罩、組裝流水線裝備(bei)、年(nian)齡(ling)改(gai)換和以(yi)外的(de)(de)(de)別的(de)(de)(de)配適器。

本質特征

規范標準D形鏈接器

EMI復合塑料殼(ke)

電(dian)源(yuan)插頭接(jie)地線(xian)控制系統凹坑

插入件由(you)阻燃材料(liao)熱延(yan)性金屬自(zi)制而成

采用行業印章學習點

應有全定(ding)位線接(jie)領域的變體

各個線(xian)接(jie)規(gui)格尺寸均具備家用插(cha)座(zuo)和電源插(cha)頭

優劣勢

抓實最佳的協(xie)調一致八(ba)卦方位

主要是于批量化生產加工但減小投資成本的處理方法(fa)

UL#E232356資格認證

兼(jian)容各種(zhong)各樣的使用者訴求(qiu)

遵循標準技術規范

層次性系列產品更適合于管(guan)腳焊錫膏或流入氬(ya)弧焊

廈門市(shi)立維(wei)創(chuang)展新(xin)材料技術(shu)進(jin)口代理(li)經售AMPHENOL工(gong)司(si)不同(tong)的(de)(de)(de)范圍產品(pin)(pin)產品(pin)(pin)系列，在AMPHENOL，AMPHENOL我相信在落實服(fu)務的(de)(de)(de)全過程中得(de)出市(shi)場導向保持的(de)(de)(de)選用就可以為大股(gu)東造就預期和(he)(he)長期的(de)(de)(de)附加值(zhi)。AMPHENOL的(de)(de)(de)各個方(fang)面項(xiang)保險業(ye)務都致力于源源不斷提升其設計(ji)的(de)(de)(de)，采購員(yuan)，制(zhi)作(zuo)和(he)(he)竣工(gong)物(wu)品(pin)(pin)的(de)(de)(de)具體方(fang)法，努(nu)力的(de)(de)(de)做到或跨越加盟商對大部分(fen)市(shi)場顧(gu)客價值(zhi)中物(wu)品(pin)(pin)管理(li)制(zhi)度的(de)(de)(de)期盼。AMPHENOL 的(de)(de)(de)行業(ye)將人身安全和(he)(he)環境污(wu)染治(zhi)理(li)性成為重(zhong)中之重(zhong)任(ren)何，并依據(ju)ISO 14001和(he)(he)OHSAS 18001等全球公認標(biao)準單位(wei)維(wei)護那些(xie)計(ji)劃(hua)方(fang)案(an)。只是，身份(fen)驗(yan)證和(he)(he)法律規定合規經營性還(huan)不過。AMPHENOL不止僅尊守法律規范就能創(chuang)造者長久(jiu)的(de)(de)(de)社(she)會價值(zhi)。

詳情介紹清楚AMPHENOL可點(dian)擊：//anchor-appliance.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


安利資訊新聞
  • 關于THUNDERLINE-Z產品申明
    關于THUNDERLINE-Z產品申明 2020-10-14 15:54:05 東莞 市立維創展科技創新現有集團，是美THUNDERLINE-Z & Fusite該品牌在在我國的授權管理公司商，其合金金屬夾層玻璃隔絕接線端子排，已大范圍操作于核工業、軍事、光纖通信等高牢靠性這個領域。
  • CMD283C3超低噪聲MMIC放大器現貨庫存
    CMD283C3超低噪聲MMIC放大器現貨庫存 2025-08-22 16:41:29 Custom MMIC（現屬 Qorvo）的 CMD283C3 極低的解決 MMIC 變大器選擇 3x3 mm 無引線工業陶瓷 QFN 二極管封裝，頻點區域 2 - 6 GHz，必備高增益控制、低的解決、低功能消耗等性狀，實在 S/C k線多行業領域。